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Staff Electronic Engineer

LumentumScience Park, Hong Kong

3 days ago

Job description

It's fun to work in a company where people truly BELIEVE in what they're doing!

Job Summary :

We are seeking a talented Staff Electronic Engineer to join our Hong Kong-based product development team. The successful candidate will play a key role in the design, development, and validation of high-speed fiber-optic transceiver products.

Job Responsibilities :

Participate actively in the full product development lifecycle for high-speed fiber-optic transceivers.
Design circuit schematics and develop substrate / PCB layouts, generating associated manufacturing documentation.
Collaborate with PCB / substrate / FPC suppliers, conducting Design for Manufacturability (DFM) reviews.
Perform signal integrity (SI) and power integrity (PI) simulations and implement optimizations based on results.
Conduct Engineering Validation Testing (EVT), Design Validation Testing (DVT), and failure analysis for transceiver products.
Evaluate new electronic devices and components for potential use in future products.

Requirements : Knowledge :

Comprehensive understanding of the circuit schematic design and PCB layout workflow.

Proficiency in RF / high-speed and power layout strategies for multi-layer boards.

Familiarity with serial communication protocols (, I2C, SPI, UART, MDIO) for MCU-peripheral interfacing.

Deep understanding of High-Density Interconnect (HDI), Semi-Additive Process (SAP) and modified Semi-Additive Process (mSAP) manufacturing techniques for PCBs, substrates, and FPCs.

Solid Experience In :

Designing electronic circuit schematics and performing PCB layouts for products incorporating analog / mixed-signal, power management, and MCU control circuits.

Preparing comprehensive manufacturing documentation including PCB files, Bill of Materials (BOM), and PCBA assembly instructions.

Conducting technical DFM discussions and reviews with PCB suppliers.

Selecting electronic components based on product reliability requirements and specifications.

Hands-on hardware validation, debugging, and root cause failure analysis.

Performing circuit simulation, including power integrity and signal integrity analysis.

Essential Skills :

Proficiency with EDA tools : Cadence OrCAD and Allegro.

Experience with CAD software : Autodesk AutoCAD.

Ability to import and handle 3D CAD models within the PCB design process.

Competence with simulation tools : LTspice, ANSYS HFSS, ANSYS SIwave, Keysight ADS (or equivalent).

Skilled in using electronic loads, power probes, and oscilloscopes for power and ripple measurements.

Skilled in using oscilloscopes and multimeters to evaluate mixed-signal circuits (ADC, DAC, IDAC, TEC drivers, etc.)

Preferred Knowledge, Experience, and Skills (Advantageous but Optional) :

Experience with other layout / CAD software (, PADS, Altium Designer, Polar Instruments, PTC Creo, SolidWorks).

Strong experience in detailed power circuit design (, high-efficiency converters, complex power distribution) and advanced power integrity (PI) simulation.

Experience with power electronics handling >

30W at low voltages (, or below).

Knowledge of advanced high-speed / RF interconnect and trace design techniques.

Understanding of NRZ, PAM4, or similar physical layer differential signalling for high-speed digital communication.

Fundamental knowledge of optoelectronics.

Experience of performing RF measurements using a Vector Network Analyzer (VNA).

Experience of performing high-speed digital oscilloscope (, Keysight's (DCA) Digital Communication Analyzers)

Qualifications :

Master's or Bachelor's degree in Electronic Engineering, Applied Physics, or a closely related discipline.

Good command of both spoken and written English and Chinese (Cantonese and / or Mandarin).

Candidate with less experience will be considered for the post of Senior Engineer

Other Requirements :

Passionate about electronic engineering, demonstrating a proactive and fast-learning attitude.

Ability to work independently, manage priorities, and perform effectively under pressure.

Willingness to collaborate within a multi-cultural and multi-national team environment.

Must be willing and able to travel occasionally to Mainland China and potentially overseas for technical support and supplier collaboration.

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Engineer • Science Park, Hong Kong

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